IEC 60191-4:2013/AMD1:2018
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages; Amendment 1

Standard No.

IEC 60191-4:2013/AMD1:2018

Release Date

2018

Published By

International Electrotechnical Commission (IEC)

Latest

IEC 60191-4:2013/AMD1:2018

Replace

IEC 47D/897/CDV:2017

IEC 60191-4:2013/AMD1:2018 history

• 2018 IEC 60191-4:2013/AMD1:2018 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages; Amendment 1
• 2018 IEC 60191-4:2018 Mechanical Standardization of Semiconductor Devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
• 2013 IEC 60191-4:2013 Mechanical Standardization of Semiconductor Devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
• 2002 IEC 60191-4/AMD2:2002 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages; Amendment 2
• 2002 IEC 60191-4:2002 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
• 2001 IEC 60191-4/AMD1:2001 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages; Amendment 1
• 1999 IEC 60191-4:1999 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
• 1987 IEC 60191-4:1987 Mechanical standardization of semiconductor devices. Part 4 : Coding system and classification into forms of package outlines for semiconductor devices