IEC 60191-4:2013
Mechanical Standardization of Semiconductor Devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

Standard No.

IEC 60191-4:2013

Release Date

2013

Published By

International Electrotechnical Commission (IEC)

Status

Be replaced

Replace By

IEC 60191-4:2018

Latest

IEC 60191-4:2013/AMD1:2018

Replace

IEC 47D/837/FDIS:2013 IEC 60191-4:1999 IEC 60191-4 AMD 1:2001 IEC 60191-4 AMD 2:2002 IEC 60191-4 Edition 2.2:2002

IEC 60191-4:2013 history

• 2018 IEC 60191-4:2013/AMD1:2018 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages; Amendment 1
• 2018 IEC 60191-4:2018 Mechanical Standardization of Semiconductor Devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
• 2013 IEC 60191-4:2013 Mechanical Standardization of Semiconductor Devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
• 2002 IEC 60191-4/AMD2:2002 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages; Amendment 2
• 2002 IEC 60191-4:2002 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
• 2001 IEC 60191-4/AMD1:2001 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages; Amendment 1
• 1999 IEC 60191-4:1999 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
• 1987 IEC 60191-4:1987 Mechanical standardization of semiconductor devices. Part 4 : Coding system and classification into forms of package outlines for semiconductor devices

IEC 60191-4:2013 Mechanical Standardization of Semiconductor Devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages was changed to KS I ISO 4869-3:2014 Acoustics — Hearing protectors — Part 3: Measurement of insertion loss of ear-muff type protectors using an acoustic test fixture.