CLC/TR 62258-3 Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage
EN 60749-20-1 Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
EN 60749-3 Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination*, 2017-06-01 Update
EN 61340-2-1 Electrostatics - Part 2-1: Measurement methods - Ability of materials and products to dissipate static electric charge
EN 61340-5-1 Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements*, 2017-05-26 Update
EN 62435-1 Electronic components - Long-term storage of electronic semiconductor devices - Part 1: General
EN 62435-2 Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms
IEC 60749-20-1 Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering*, 2019-06-26 Update
IEC 60749-3 Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
IEC 61340-2-1 Amendment 1 - Electrostatics - Part 2-1: Measurement methods - Ability of materials and products to dissipate static electric charge*, 2022-01-01 Update
IEC 61340-5-1 Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements; Corrigendum 1*, 2017-05-01 Update
IEC 62435-1 Electronic components - Long-term storage of electronic semiconductor devices - Part 1: General
IEC 62435-2 Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms
IEC 62435-4 Electronic components - Long-term storage of electronic semiconductor devices - Part 4: Storage*, 2018-06-01 Update