BS EN 60068-3-13:2016
Environmental testing. Supporting documentation and guidance on Test T. Soldering
- Standard No.
- BS EN 60068-3-13:2016
- Release Date
- 2016
- Published By
- British Standards Institution (BSI)
- Latest
- BS EN 60068-3-13:2016
- Replace
- BS EN 60068-2-44:1995
BS EN 60068-3-13:2016 Referenced Document
- EN 60068-2 Environmental Testing Part 2: Tests - Guidance for Solar Radiation Testing
- EN 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
- EN 61190-1-1 Attachment Materials for Electronic Assembly - Part 1-1: Requirements for Soldering Fluxes for High-Quality Interconnections in Electronics Assembly
- EN 61191 Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method
- EN 61192 Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies
- EN 61760-1 Surface Mounting Technology Part 1: Standard Method for the Specification of Surface Mounting Components (SMDs)
- EN 61760-4 Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
- EN 62137-3 Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints
- IEC 60068-2 Environmental testing - Part 2: Tests - ALL PARTS*， 2023-06-28 Update
- IEC 61190-1-1 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
- IEC 61191 Printed board assemblies – Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method (Edition 1.0)
- IEC 61192 Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies
- IEC 61760-1 Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)*， 2020-07-14 Update
- IEC 61760-4 Amendment 1 - Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices*， 2018-01-01 Update
- IEC 62137-3 Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints
BS EN 60068-3-13:2016 history
- 2016 BS EN 60068-3-13:2016 Environmental testing. Supporting documentation and guidance on Test T. Soldering
- 1995 BS EN 60068-2-44:1995 Environmental testing - Test methods - Tests - Guidance on Test T. Soldering
