IEC 61191-6:2010 PDF

Scope: This part of IEC 61191 specifies the evaluation criteria for voids on the scale of the thermal cycle life@ and the measurement method of voids using X-ray observation. This part of IEC 61191 is applicable to the voids generated in the solder joints of BGA and LGA soldered on a board. This part of IEC 61191 is not applicable to the BGA package itself before it is assembled on a board. This standard is applicable also to devices having joints made by melt and re-solidification@ such as flip chip devices and multi-chip modules@ in addition to BGA and LGA. This standard is not applicable to joints with under-fill between a device and a board@ or to solder joints within a device package. This standard is applicable to macrovoids of the sizes of from 10 ?? to several hundred micrometres generated in a soldered joint@ but is not applicable to smaller voids (typically@ planar microvoids) with a size of smaller than 10 ?? in diameter. This standard is intended for evaluation purposes and is applicable to ? research studies@ ? off-line production process control and ? reliability assessment of assembly.

IEC 61191-6:2010 history

2010 IEC 61191-6:2010 Printed board assemblies – Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method (Edition 1.0)