ASTM F3166-16 PDF

Scope: 1.1 This specification details the generic criteria requirements of high pure titanium sputtering targets used as thin film material for through-silicon vias (TSV) metallization in advance packaging.

1.2 Sputtering target purity, grain size, inner quality, bonding, dimension, and appearance specifications are included in this specification along with references for qualification test methods. Reliability, certification, traceability, and packaging requirements are also included.

1.2.1 Purity Requirements:

1.2.1.1 Metallic element impurities, and

1.2.1.2 Non-metallic element impurities.

1.2.2 Grain Size Requirements—Grain size.

1.2.3 Inner Quality Requirements—Internal defect.

1.2.4 Bonding Requirements:

1.2.4.1 Backing plate, and

1.2.4.2 Bonding ratio.

1.2.5 Configuration Requirements:

1.2.5.1 Dimension,

1.2.5.2 Tolerance, and

1.2.5.3 Surface roughness.

1.2.6 Appearance Requirements—Surface cleanness.

1.3 The values stated in SI units are to be regarded as standard. No other units of measurement are included in this standard.

1.4 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

ASTM F3166-16 Referenced Document

ASTM B209 Standard Specification for Aluminum and Aluminum- Alloy Sheet and Plate
ASTM B248 Standard Specification for General Requirements for Wrought Copper and Copper-Alloy Plate, Sheet, Strip, and Rolled Bar
ASTM E1001 Standard Practice for Detection and Evaluation of Discontinuities by the Immersed Pulse-Echo Ultrasonic Method Using Longitudinal Waves
ASTM E112 Standard Test Methods for Determining Average Grain Size
ASTM F1512 Standard Practice for Ultrasonic C-Scan Bond Evaluation of Sputtering Target-Backing Plate Assemblies
ASTM F1709 Standard Specification for High Purity Titanium Sputtering Targets for Electronic Thin Film Applications
ASTM F1710 Standard Test Method for Trace Metallic Impurities in Electronic Grade Titanium by High Mass-Resolution Glow Discharge Mass Spectrometer

2016 ASTM F3166-16 Standard Specification for High-Purity Titanium Sputtering Target Used for Through-Silicon Vias (TSV) Metallization