ASTM F1709-97(2016)
Standard Specification for High Purity Titanium Sputtering Targets for Electronic Thin Film Applications

Standard No.
ASTM F1709-97(2016)
Release Date
2016
Published By
American Society for Testing and Materials (ASTM)
Latest
ASTM F1709-97(2016)
Scope
1.1 This specification covers pure titanium sputtering targets used as a raw material in fabricating semiconductor electronic devices. 1.2 This standard sets purity grade levels, physical attributes, analytical methods, and packaging. 1.2.1 The grade designation is a measure of total metallic impurity content. The grade designation does not necessarily indicate suitability for a particular application because factors other than total metallic impurity may influence performance.

ASTM F1709-97(2016) Referenced Document

  • ASTM E112 Standard Test Methods for Determining Average Grain Size

ASTM F1709-97(2016) history

  • 2016 ASTM F1709-97(2016) Standard Specification for High Purity Titanium Sputtering Targets for Electronic Thin Film Applications
  • 1997 ASTM F1709-97(2008) Standard Specification for High Purity Titanium Sputtering Targets for Electronic Thin Film Applications
  • 1997 ASTM F1709-97(2002) Standard Specification for High Purity Titanium Sputtering Targets for Electronic Thin Film Applications
  • 1996 ASTM F1709-97 Standard Specification for High Purity Titanium Sputtering Targets for Electronic Thin Film Applications
Standard Specification for High Purity Titanium Sputtering Targets for Electronic Thin Film Applications



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