GOST R IEC 60068-2-20-2015
Environmental testing. Part 2-20. Tests. Test T. Test methods for solderability and resistance to soldering heat of devices with leads

Standard No.

GOST R IEC 60068-2-20-2015

Release Date

2015

Published By

RU-GOST R

Latest

GOST R IEC 60068-2-20-2015

GOST R IEC 60068-2-20-2015 Referenced Document

• IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
• IEC 60068-2-2:2007 Environmental testing - Part 2-2: Tests - Test B: Dry heat
• IEC 60068-2-66:1994 Environmental testing - Part 2: Test methods - Test Cx: Damp heat, steady state (unsaturated pressurized vapour)
• IEC 60068-2-78:2012 Environmental testing - Part 2-78: Tests - Test Cab: Damp heat, steady state
• IEC 60194:2006 Printed board design, manufacture and assembly - Terms and definitions
• IEC 61191-3:1998 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
• IEC 61191-4:1998 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies

GOST R IEC 60068-2-20-2015 history

• 2015 GOST R IEC 60068-2-20-2015 Environmental testing. Part 2-20. Tests. Test T. Test methods for solderability and resistance to soldering heat of devices with leads