GOST R IEC 60068-2-20-2015
Environmental testing. Part 2-20. Tests. Test T. Test methods for solderability and resistance to soldering heat of devices with leads

Standard No.
GOST R IEC 60068-2-20-2015
Release Date
2015
Published By
RU-GOST R
Latest
GOST R IEC 60068-2-20-2015

GOST R IEC 60068-2-20-2015 Referenced Document

  • IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
  • IEC 60068-2-2:2007 Environmental testing - Part 2-2: Tests - Test B: Dry heat
  • IEC 60068-2-66:1994 Environmental testing - Part 2: Test methods - Test Cx: Damp heat, steady state (unsaturated pressurized vapour)
  • IEC 60068-2-78:2012 Environmental testing - Part 2-78: Tests - Test Cab: Damp heat, steady state
  • IEC 60194:2006 Printed board design, manufacture and assembly - Terms and definitions
  • IEC 61191-3:1998 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
  • IEC 61191-4:1998 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies

GOST R IEC 60068-2-20-2015 history

  • 2015 GOST R IEC 60068-2-20-2015 Environmental testing. Part 2-20. Tests. Test T. Test methods for solderability and resistance to soldering heat of devices with leads



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