BS EN 60068-2-58:2015 Environmental testing. Tests. Test Td. Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
EN 60068-1 Environmental testing - Part 1: General and guidance
EN 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
EN 60194 Printed board design, manufacture and assembly - Terms and definitions
EN 61190-1-1 Attachment Materials for Electronic Assembly - Part 1-1: Requirements for Soldering Fluxes for High-Quality Interconnections in Electronics Assembly
EN 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
EN 61191-2 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies*， 2017-10-13 Update
EN 61760-1 Surface Mounting Technology Part 1: Standard Method for the Specification of Surface Mounting Components (SMDs)
EN 61760-3 Surface mounting technology - Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering
EN ISO 9454-2:2000 Soft soldering fluxes - Classification and requirements - Part 2: Performance requirements (ISO 9454-2:1998)
IEC 60068-1 Environmental testing - Part 1: General and guidance
IEC 60194 Printed board design, manufacture and assembly - Terms and definitions
IEC 61190-1-1 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
IEC 61191-2 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies*， 2017-01-01 Update
IEC 61760-1 Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)*， 2020-07-14 Update
IEC 61760-3 Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering*， 2021-02-01 Update
ISO 9454-2:1998 Soft soldering fluxes - Classification and requirements - Part 2: Performance requirements
BS EN 60068-2-58:2015 history
2018BS EN 60068-2-58:2015+A1:2018 Environmental testing - Tests. Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
2015BS EN 60068-2-58:2015 Environmental testing. Tests. Test Td. Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
2004BS EN 60068-2-58:2004 Environmental testing - Tests - Test Td - Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)