BS EN 60068-2-58:2015
Environmental testing. Tests. Test Td. Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

Standard No.
BS EN 60068-2-58:2015
Release Date
2015
Published By
British Standards Institution (BSI)
Status
 2018-05
Replace By
BS EN 60068-2-58:2015+A1:2018
Latest
BS EN 60068-2-58:2015+A1:2018
Replace
BS EN 60068-2-58:2004

BS EN 60068-2-58:2015 Referenced Document

  • EN 60068-1 Environmental testing - Part 1: General and guidance
  • EN 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
  • EN 60194 Printed board design, manufacture and assembly - Terms and definitions
  • EN 61190-1-1 Attachment Materials for Electronic Assembly - Part 1-1: Requirements for Soldering Fluxes for High-Quality Interconnections in Electronics Assembly
  • EN 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
  • EN 61191-2 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies*2017-10-13 Update
  • EN 61760-1 Surface Mounting Technology Part 1: Standard Method for the Specification of Surface Mounting Components (SMDs)
  • EN 61760-3 Surface mounting technology - Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering
  • EN ISO 9454-2:2000 Soft soldering fluxes - Classification and requirements - Part 2: Performance requirements (ISO 9454-2:1998)
  • IEC 60068-1 Environmental testing - Part 1: General and guidance
  • IEC 60194 Printed board design, manufacture and assembly - Terms and definitions
  • IEC 61190-1-1 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
  • IEC 61191-2 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies*2017-01-01 Update
  • IEC 61760-1 Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)*2020-07-14 Update
  • IEC 61760-3 Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering*2021-02-01 Update
  • ISO 9454-2:1998 Soft soldering fluxes - Classification and requirements - Part 2: Performance requirements

BS EN 60068-2-58:2015 history

  • 2018 BS EN 60068-2-58:2015+A1:2018 Environmental testing - Tests. Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
  • 2015 BS EN 60068-2-58:2015 Environmental testing. Tests. Test Td. Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
  • 2004 BS EN 60068-2-58:2004 Environmental testing - Tests - Test Td - Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)



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