GOST IEC 61188-5-8-2013
Printed boards and printed board assemblies. Design and use. Part 5-8. Attachment (land/joint) considerations. Area array components (BGA, FBGA, CGA, LGA)

Standard No.

GOST IEC 61188-5-8-2013

Release Date

2013

Published By

RU-GOST R

Latest

GOST IEC 61188-5-8-2013

GOST IEC 61188-5-8-2013 Referenced Document

• IEC 60068-2-58:2005 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
• IEC 60191-2:1966 Mechanical standardization of semiconductor devices. Part 2 : Dimensions
• IEC 61188-5-1:2002 Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations; Generic requirements
• IEC 62090:2002 Product package labels for electronic components using bar code and two-dimensional symbologies

GOST IEC 61188-5-8-2013 history

• 2013 GOST IEC 61188-5-8-2013 Printed boards and printed board assemblies. Design and use. Part 5-8. Attachment (land/joint) considerations. Area array components (BGA, FBGA, CGA, LGA)