IEC 60286-3:2013 PDF

Standard No.: IEC 60286-3:2013
Release Date: 2013
Published By: International Electrotechnical Commission (IEC)
Status: Be replaced
Replace By: IEC 60286-3:2019 RLV
Latest: IEC 60286-3:2022 CMV
Replace: IEC 40/2200/FDIS:2013 IEC 60286-3:2007 IEC 60286-3-1:2009 IEC 60286-3-2:2009

Scope: This part of IEC 60286 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the abovementioned purposes. This standard also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips).

IEC 60286-3:2013 Referenced Document

IEC 60191-2 Mechanical standardization of semiconductor devices - Part 2: Dimensions
IEC 61340-5-1 Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements; Corrigendum 1*， 2017-05-01 Update

0000 IEC 60286-3:2022 CMV
0000 IEC 60286-3:2019 RLV
2013 IEC 60286-3:2013 Packaging of components for automatic handling.Part 3: Packaging of surface mount components on continuous tapes
2007 IEC 60286-3:2007 Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
1997 IEC 60286-3:1997 Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
1991 IEC 60286-3:1991 Packaging of components for automatic handling; part 3: packaging of leadless components on continuous tapes
1970 IEC 60286-3:1986 Packing of components for automatic handling - Part 3: Packaging of leadless components on continuous tapes