IEC 60286-3:2007
Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes

Standard No.

IEC 60286-3:2007

Release Date

2007

Published By

International Electrotechnical Commission (IEC)

Status

Be replaced 2019-01

Replace By

IEC 60286-3:2013

Latest

IEC 60286-3:2022 CMV

Scope

This part of IEC 60286 is applicable to the (ape packaging of electronic components without leads or with lead stumps which are intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes. This standard also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips).

IEC 60286-3:2007 history

• 0000 IEC 60286-3:2022 CMV
• 0000 IEC 60286-3:2019 RLV
• 2013 IEC 60286-3:2013 Packaging of components for automatic handling.Part 3: Packaging of surface mount components on continuous tapes
• 2007 IEC 60286-3:2007 Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
• 1997 IEC 60286-3:1997 Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
• 1991 IEC 60286-3:1991 Packaging of components for automatic handling; part 3: packaging of leadless components on continuous tapes
• 1970 IEC 60286-3:1986 Packing of components for automatic handling - Part 3: Packaging of leadless components on continuous tapes