IEC 60127-4:2005
Miniature fuses - Part 4: Universal modular fuse-links (UMF) - Through-hole and surface mount types

Standard No.

IEC 60127-4:2005

Release Date

2005

Published By

International Electrotechnical Commission (IEC)

Status

Be replaced 2008-05

Replace By

IEC 60127-4:2005/AMD1:2008

Latest

IEC 60127-4:2005/AMD2:2012

Replace

IEC 32C/362/FDIS:2004 IEC 60127-4:1996 IEC 60127-4 AMD 1:2002 IEC 60127-4 AMD 2:2003

Scope

This part of IEC 60127 relates to universal modular fuse-links (UMF) for printed circuits and other substrate systems, used for the protection of electric appliances, electronic equipment, and component parts thereof, normally intended to be used indoors

IEC 60127-4:2005 history

• 2012 IEC 60127-4:2005/AMD2:2012 Miniature fuses - Part 4: Universal modular fuse-links (UMF) - Through-hole and surface mount types; Amendment 2
• 2012 IEC 60127-4:2012 Miniature fuses - Part 4: Universal modular fuse-links (UMF) - Through-hole and surface mount types
• 2008 IEC 60127-4:2005/AMD1:2008 Miniature fuses - Part 4: Universal modular fuse-links (UMF) - Through-hole and surface mount types; Amendment 1
• 2005 IEC 60127-4:2005 Miniature fuses - Part 4: Universal modular fuse-links (UMF) - Through-hole and surface mount types
• 1970 IEC 60127-4:1996/AMD2:2003 Amendment 2 - Miniatures fuses - Part 4: Universal Modular Fuse-Links (UMF)
• 1970 IEC 60127-4:1996/AMD1:2002 Amendment 1 - Miniatures fuses - Part 4: Universal Modular Fuse-Links (UMF)
• 1996 IEC 60127-4:1996 Miniature fuses - Part 4: Universal Modular Fuse-links (UMF)
• 1970 IEC 60127-4:1989 TTD (1989) Universal modular fuses (UMF)