IEC 60664-3:2010 BASIC SAFETY PUBLICATION Insulation coordination for equipment within low-voltage systems – Part 3: Use of coating, potting or moulding for protection against pollution
This part of IEC 60664 applies to assemblies protected against pollution by the use of
coating, potting or moulding, thus allowing a reduction of clearance and creepage distances
as described in Part 1 or Part 5.
This standard describes the requirements and test procedures for two methods of protection:
– type 1 protection improves the microenvironment of the parts under the protection;
– type 2 protection is considered to be similar to solid insulation.
This standard also applies to all kinds of protected printed boards, including the surface of
inner layers of multi-layer boards, substrates and similarly protected assemblies. In the case
of multi-layer printed boards, the distances through an inner layer are covered by the
requirements for solid insulation in Part 1.
This standard refers only to permanent protection. It does not cover assemblies that are
subjected to mechanical adjustment or repair.
The principles of this standard are applicable to functional, basic, supplementary and
reinforced insulation.
IEC 60664-3:2010 Referenced Document
IEC 60068-2-14:2009 Environmental testing - Part 2-14: Tests - Test N: Change of temperature
IEC 60068-2-1:2007 Environmental testing - Part 2-1: Tests - Test A: Cold
IEC 60068-2-2:2007 Environmental testing - Part 2-2: Tests - Test B: Dry heat
IEC 60068-2-78:2001 Environmental testing - Part 2-78: Tests; Test Cab: Damp heat, steady state
IEC 60454-3-1:1998 Pressure-sensitive adhesive tapes for electrical purposes - Part 3: Specifications for individual materials - Sheet 1: PVC film tapes with pressure-sensitive adhesive
IEC 60664-1:2007 Insulation coordination for equipment within low-voltage systems - Part 1: Principles, requirements and tests
IEC 60664-5:2007 Insulation coordination for equipment within low-voltage systems - Part 5: Comprehensive method for determining clearances and creepage distances equal to or less than 2 mm
IEC 61189-2:2006 Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
IEC 61189-3:2007 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
IEC 61249-2 Materials for printed boards and other interconnecting structures - Part 2-9: Reinforced base materials clad and unclad; Bismaleimide/triazine modified epoxide or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burn
IEC 60664-3:2010 history
0000 IEC 60664-3:2016 RLV
2010IEC 60664-3:2003/AMD1:2010/COR1:2010 Corrigendum 1 to amendment 1 - Insulation coordination for equipment within low-voltage systems - Part 3: Use of coating, potting or moulding for protection against pollution
2010IEC 60664-3:2010 BASIC SAFETY PUBLICATION Insulation coordination for equipment within low-voltage systems – Part 3: Use of coating, potting or moulding for protection against pollution
2003IEC 60664-3:2003 Insulation coordination for equipment within low-voltage systems - Part 3: Use of coating, potting or moulding for protection against pollution
1992IEC 60664-3:1992 Insulation coordination for equipment within low-voltage systems; part 3: use of coatings to achieve insulation coordination of printed board assemblies