JIS C 0806-3:2010
Packaging of components for automatic handling -- Part 3: Packaging of surface mount components on continuous tapes

Standard No.

JIS C 0806-3:2010

Release Date

2010

Published By

Japanese Industrial Standards Committee (JISC)

Status

Withdraw

Replace By

JIS C 0806-3:2014

Latest

JIS C 0806-3:2014

Replace

JIS C 0806-3:1999

Scope

This Standard is applicable to the tape packaging of electronic components used for automatic handling without leads or with lead stumps which are intended to be connected to electronic circuits.

JIS C 0806-3:2010 Referenced Document

• IEC 60191-2 Mechanical standardization of semiconductor devices - Part 2: Dimensions*， 2012-09-21 Update
• IEC 61340-5-1 Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements; Corrigendum 1*， 2017-05-01 Update
• JIS K 6999 Plastics -- Generic identification and marking of plastics products
• JIS X 0503 Bar code symbol -- CODE39 -- Basic specifications*， 2012-06-20 Update
• JIS X 9001 Alphanumeric character sets for optical recognition

JIS C 0806-3:2010 history

• 2021 JIS C 0806-3:2021 Packaging of components for automatic handling -- Part 3: Packaging of surface mount components on continuous tapes
• 2014 JIS C 0806-3:2014 Packaging of components for automatic handling -- Part 3: Packaging of surface mount components on continuous tapes
• 2010 JIS C 0806-3:2010 Packaging of components for automatic handling -- Part 3: Packaging of surface mount components on continuous tapes
• 1999 JIS C 0806-3:1999 Packaging of components for automatic handling -- Part 3: Packaging of surface mount components on continuous tapes
• 1995 JIS C 0806:1995 Packaging of electronic components on continuous tapes (surface mounting devices)