This standard applies to the taping of leadless or stamped lead type electronic components used in electronic circuits. It also specifies the requirements for taping used for automatic component mounting. For the above purpose, the dimensions are limited to those necessary for taping parts.
JIS C 0806-3:1999 history
2021JIS C 0806-3:2021 Packaging of components for automatic handling -- Part 3: Packaging of surface mount components on continuous tapes
2014JIS C 0806-3:2014 Packaging of components for automatic handling -- Part 3: Packaging of surface mount components on continuous tapes
2010JIS C 0806-3:2010 Packaging of components for automatic handling -- Part 3: Packaging of surface mount components on continuous tapes
1999JIS C 0806-3:1999 Packaging of components for automatic handling -- Part 3: Packaging of surface mount components on continuous tapes
1995JIS C 0806:1995 Packaging of electronic components on continuous tapes (surface mounting devices)