JIS C 60068-2-21:2009 PDF

Scope: This Japanese Industrial Standard has been prepared based on the sixth edition of IEC 60068-2-21 published in 2006 without modifying the technical contents.

JIS C 60068-2-21:2009 Referenced Document

IEC 61188-5 Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)
JIS B 1002:1985 Dimensions of widths across flats
JIS C 60068-1:1993 Environmental testing Part 1: General and guidance
JIS C 60068-2-20:1996 Basic environmental testing procedures Part 2: Tests. Test T: Soldering
JIS C 60068-2-58:2006 Environmental testing -- Part 2: Tests -- Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
JIS C 60068-2-61:1996 Environmental testing Part 2: Test methods Test Z/ABDM: Climatic sequence
JIS C 61191-2:2006 Printed board assemblies -- Part 2: Sectional specification -- Requirements for surface mount soldered assemblies
JIS C 6484:2005 Base materials for printed circuits -- Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test)
JIS Z 3282:2006 Soft solders -- Chemical compositions and forms

2023 JIS C 60068-2-21:2023 Environmental testing -- Part 2-21: Tests -- Test U: Robustness of terminations and integral mounting devices
2009 JIS C 60068-2-21:2009 Environmental testing -- Part 2-21: Tests -- Test U: Robustness of terminations and integral mounting devices
2002 JIS C 60068-2-21:2002 Environmental testing -- Part 2-21: Tests -- Test U: Robustness of termination and integral mounting devices
0000 JIS C 0051:1994