JIS C 60068-2-58:2006
Environmental testing -- Part 2: Tests -- Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

Standard No.

JIS C 60068-2-58:2006

Release Date

2006

Published By

Japanese Industrial Standards Committee (JISC)

Status

Withdraw

Replace By

JIS C 60068-2-58:2016

Latest

JIS C 60068-2-58:2016

Scope

This standard specifies test methods for the solderability of surface mount devices (hereinafter referred to as SMD), solderability of electrodes, and heat resistance.

JIS C 60068-2-58:2006 history

• 2016 JIS C 60068-2-58:2016 Environmental testing -- Part 2-58: Tests -- Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
• 2006 JIS C 60068-2-58:2006 Environmental testing -- Part 2: Tests -- Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
• 2002 JIS C 60068-2-58:2002 Environmental testing -- Part 2: Tests -- Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
• 1994 JIS C 0054:1994 Environmental testing Part 2: Tests -- Test Td: Solderability, resistance to dissolution of metallization and to soldering heat of Surface Mounting Devices (SMD)