JIS C 0054:1994 Environmental testing Part 2: Tests -- Test Td: Solderability, resistance to dissolution of metallization and to soldering heat of Surface Mounting Devices (SMD)
2016JIS C 60068-2-58:2016 Environmental testing -- Part 2-58: Tests -- Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
2006JIS C 60068-2-58:2006 Environmental testing -- Part 2: Tests -- Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
2002JIS C 60068-2-58:2002 Environmental testing -- Part 2: Tests -- Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
1994JIS C 0054:1994 Environmental testing Part 2: Tests -- Test Td: Solderability, resistance to dissolution of metallization and to soldering heat of Surface Mounting Devices (SMD)