SJ/T 11390-2009
Test method for lead-free solders (English Version)
- Standard No.
- SJ/T 11390-2009
- Language
- Chinese, Available in English version
- Release Date
- 2009
- Published By
- Professional Standard - Electron
- Status
- 2020-07
- Replace By
- SJ/T 11390-2019
- Latest
- SJ/T 11390-2019
- Scope
- This standard specifies the melting temperature, mechanical stretching, expansion, wetting, solder joint stretching and shearing of lead-free solders, 45° stretching of QFP lead solder joints, chip component solder joint shearing and dynamic oxidation of solder slag. Quantitative test methods. This standard applies to tin-based lead-free solder.
SJ/T 11390-2009 Referenced Document
- GB/T 14020-1992 Hydrogenated rosin
- GB/T 5231-2001 Wrought copper and copper alloys chemical composition limits and forms of wrought products
- GB/T 8619-1988 Method of the strength test for brazed and soldered seam
- SJ/T 11319-2005 Quantity test method of the oxidation sludge in the tin solder
SJ/T 11390-2009 history
- 2019 SJ/T 11390-2019 Lead-free solder test methods
- 2009 SJ/T 11390-2009 Test method for lead-free solders
