GB/T 4909.12-2009
Test methods for bare wires.Part 12:Solderability test of coating.Solder globule method (English Version)

Standard No.

GB/T 4909.12-2009

Language

Chinese, Available in English version

Release Date

2009

Published By

General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China

Latest

GB/T 4909.12-2009

Replace

GB/T 4909.12-1985

Scope

This part of GB/T 4909 specifies the test equipment, sample preparation, measurement procedures, test results and evaluation, etc. for the solderability test of the bare wire solder ball coating. This section is applicable to test the wettability of the surface of tinned copper wire by molten solder, which is expressed by a specific time. The method in this part is to use the sample to divide the solder ball of molten solder into two halves, and measure the time required for the sample to cut the solder ball until the solder flows around the sample and covers the sample. This time indicates the solderability of the sample. This section should be used together with GB/T 4909.1-2009.

GB/T 4909.12-2009 Referenced Document

• GB/T 4909.1-2009 Test methods for bare wires.Part 1:General

GB/T 4909.12-2009 history

• 2009 GB/T 4909.12-2009 Test methods for bare wires.Part 12:Solderability test of coating.Solder globule method
• 1985 GB/T 4909.12-1985 Test methods for bare wires--Solderability test of coating--Solder globule method

GB/T 4909.12-2009 -All Parts