This standard prescribes general requirements
for the classification and characterization of fluxes for high
quality solder interconnections. This standard may be used
for quality control and procurement purposes.
The purpose of this standard is to classify
and characterize tin/lead and lead-free soldering flux materials
for use in electronic metallurgical interconnections for
printed circuit board assembly. Soldering flux materials
include the following: liquid flux, paste flux, solder paste,
solder cream, and flux-coated and flux-cored solder wires
and preforms. It is not the intent of this standard to exclude
any acceptable flux or soldering material; however, these
materials must produce the desired electrical and metallurgical
interconnection.
The requirements for fluxes are defined in general terms for
standard classification. Appendix B has additional information
that will help users understand some of the requirements
of this standard. In practice, where more stringent
requirements are necessary or other manufacturing processes
are used, the user shall define these as additional
requirements.
IPC J-STD-004B-2008 Referenced Document
ASTM D1298 Standard Test Method for Density, Relative Density (Specific Gravity), or API Gravity of Crude Petroleum and Liquid Petroleum Products by Hydrometer Method
BS EN 14582 Characterization of waste. Halogen and sulfur content. Oxygen combustion in closed systems and determination methods
IEC 61189-5 Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
ISO 10012 Measurement management systems - Requirements for measurement processes and measuring equipment
ISO 9001:2000 Quality management systems - Requirements
ISO/TS 16949 Quality management systems - Particular requirements for the application of ISO 9001:2008 for automotive production and relevant service part organizations