DIN EN 60068-2-20:2009
Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads (IEC 60068-2-20:2008); German version EN 60068-2-20:2008

Standard No.
DIN EN 60068-2-20:2009
Release Date
2009
Published By
German Institute for Standardization
Latest
DIN EN 60068-2-20:2009
Replace
DIN IEC 60068-2-20:2006 DIN IEC 60068-2-20:1991

DIN EN 60068-2-20:2009 Referenced Document

  • IEC 60068-1 Environmental testing - Part 1: General and guidance*2013-10-01 Update
  • IEC 60068-2-2 Environmental testing - Part 2-2: Tests - Test B: Dry heat
  • IEC 60194 Printed board design, manufacture and assembly - Terms and definitions*2015-04-01 Update
  • IEC 61191-3 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies*2017-05-01 Update
  • IEC 61191-4 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies*2017-06-30 Update

DIN EN 60068-2-20:2009 history

  • 2009 DIN EN 60068-2-20:2009 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads (IEC 60068-2-20:2008); German version EN 60068-2-20:2008
  • 0000 DIN IEC 60068-2-20:2006
  • 0000 DIN IEC 60068-2-20:1991
Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads (IEC 60068-2-20:2008); German version EN 60068-2-20:2008

DIN EN 60068-2-20:2009 -All Parts




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