IEC 60191-6-2:2001/COR1:2002
Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages;
- Standard No.
- IEC 60191-6-2:2001/COR1:2002
- Release Date
- 2002
- Published By
- International Electrotechnical Commission (IEC)
- Latest
- IEC 60191-6-2:2001/COR1:2002
- Scope
- This standard is Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages; Corrigendum 1.
IEC 60191-6-2:2001/COR1:2002 history
- 2002 IEC 60191-6-2:2001/COR1:2002 Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages;
- 2001 IEC 60191-6-2:2001 Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
