IEC 60191-6-2:2001
Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
- Standard No.
- IEC 60191-6-2:2001
- Release Date
- 2001
- Published By
- International Electrotechnical Commission (IEC)
- Status
- Replace By
- IEC 60191-6-2:2001/COR1:2002
- Latest
- IEC 60191-6-2:2001/COR1:2002
- Replace
- IEC 47D/460/FDIS:2001
- Scope
- This part of IEC 60191 covers the requirements for the preparation of drawings of integrated circuit outlines for the various ball terminal packages, e.g. ceramic ball grid array (C-BGA), plastic ball grid array (P-BGA), tape ball grid array (T-BGA) and others as well as column terminal packages, e.g. ceramic column grid array (C-CGA).
IEC 60191-6-2:2001 history
- 2002 IEC 60191-6-2:2001/COR1:2002 Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages;
- 2001 IEC 60191-6-2:2001 Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
