- Standard No.
- GB/T 2423.32-2008
- Language
- Chinese, Available in English version
- Release Date
- 2008
- Published By
- General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China
- Latest
-
GB/T 2423.32-2008
- Replace
-
GB/T 2424.21-1985
GB/T 2423.32-1985
- Scope
- This part of GB/T 2423 is applicable to the determination of the solderability of soldering terminals of any shape of components, especially for the arbitration test and the evaluation of the solderability of soldering terminals of components that cannot be quantitatively tested by other methods. For surface mount equipment, IEC 60068-2-69 should be used, if appropriate.
GB/T 2423.32-2008 Referenced Document
- GB/T 2421-1999 Environmental testing for electric and electronic products Part 1: General and guidance
- GB/T 2423.28-2005 Environmental testing for electric and electronic products.Part2:Test methods-Test T:Soldering
- IEC 61190-1-3:2002 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
GB/T 2423.32-2008 history
- 2008 GB/T 2423.32-2008 Environmental testing for electric and electronic products.Part 2:Test methods.Test Ta:Solderability test by the wetting balance method
- 1985 GB/T 2423.32-1985 Basic environmental testing procedures for electric and electronic products--Solderability testing by the wetting balance method
GB/T 2423.32-2008 Environmental testing for electric and electronic products.Part 2:Test methods.Test Ta:Solderability test by the wetting balance method has been changed from GB/T 2424.21-1985 Basic environmental testing procedures for electric and electronic products--Guidance on solderability testing by the wetting balance method.