IEC 60664-5:2003
Insulation coordination for equipment within low-voltage systems - Part 5: A comprehensive method for determining clearances and creepage distances equal to or less than 2 mm

Standard No.

IEC 60664-5:2003

Release Date

2003

Published By

International Electrotechnical Commission (IEC)

Status

Be replaced 2015-01

Replace By

IEC 60664-5:2007

Latest

IEC 60664-5:2007

Scope

Specifies the dimensioning of clearances and creepage distances for spacings equal to or less than 2 mm for printed wiring board and equivalent constructions, where the clearance and the creepage distance are identical and are along the surface of solid

IEC 60664-5:2003 history

• 2007 IEC 60664-5:2007 Insulation coordination for equipment within low-voltage systems - Part 5: Comprehensive method for determining clearances and creepage distances equal to or less than 2 mm
• 2003 IEC 60664-5:2003 Insulation coordination for equipment within low-voltage systems - Part 5: A comprehensive method for determining clearances and creepage distances equal to or less than 2 mm