IEC 61760-2:2007 PDF

Scope: This International Standard describes the transportation and storage conditions for surface mounting devices (SMDs) that are fulfilled in order to enable trouble-free processing of surface mounting devices, both active and passive. (Conditions for printed boards are not taken into consideration.) The object of this standard is to ensure that users of SMDs receive and store products that can be further processed (e.g. positioned, soldered) without prejudice to quality and reliability. Improper transportation and storage of SMDs may cause deterioration and result in assembly problems such as poor solderability, delamination and "popcorning".

IEC 61760-2:2007 Referenced Document

IEC 60286-3 Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes*， 2022-11-15 Update
IEC 60286-4 Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms*， 2013-07-01 Update
IEC 60286-5 Packaging of components for automatic handling - Part 5: Matrix trays*， 2018-04-25 Update
IEC 60286-6 Packaging of components for automatic handling - Part 6: Bulk case packaging for surface mounting components
IEC 60721-3-1 Classification of environmental conditions — Part 3-1: Classification of groups of environmental parameters and their severities — Storage*， 2018-02-23 Update

0000 IEC 61760-2:2021 RLV
2007 IEC 61760-2:2007 Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
1998 IEC 61760-2:1998 Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide