This International Standard describes the transportation and storage conditions for surface mounting devices (SMDs) that are fulfilled in order to enable trouble free processing of surface mounting devices, both active and passive. (Conditions for printed boards are not taken into consideration.)
The object of this International Standard is to ensure that users of SMDs receive and store products that can be further processed (e.g. positioned, soldered) without prejudice to quality and reliability. Improper transportation and storage of SMDs may cause deterioration, and result in assembly problems such as poor solderability, delamination and "popcorning".
IEC 61760-2:1998 history
0000 IEC 61760-2:2021 RLV
2007IEC 61760-2:2007 Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
1998IEC 61760-2:1998 Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide