BS EN ISO 9455-17:2003
Soft soldering fluxes - Test methods - Surface insulation resistance comb test and electrochemical migration test of flux residues

Standard No.

BS EN ISO 9455-17:2003

Release Date

2003

Published By

British Standards Institution (BSI)

Status

Be replaced

Replace By

BS EN ISO 9455-17:2006

Latest

BS EN ISO 9455-17:2024

Replace

98/719103 DC:1998

Scope

ISO 9455-17:2002 specifies a method of testing for deleterious effects that may arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead solders. This test method is also applicable to fluxes for use with lead-free solders. However, the soldering temperatures may be adjusted with agreement between tester and customer.

BS EN ISO 9455-17:2003 history

• 2024 BS EN ISO 9455-17:2024 Soft soldering fluxes. Test methods - Surface insulation resistance comb test and electrochemical migration test of flux residues
• 2006 BS EN ISO 9455-17:2006 Soft soldering fluxes. Test methods. Surface insulation resistance comb test and electrochemical migration test of flux residues
• 2003 BS EN ISO 9455-17:2003 Soft soldering fluxes - Test methods - Surface insulation resistance comb test and electrochemical migration test of flux residues