BS EN ISO 9455-17:2024 Soft soldering fluxes. Test methods - Surface insulation resistance comb test and electrochemical migration test of flux residues
This document specifies a method of testing for deleterious effects that can arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes, as specified in constituted with eutectic or near-eutectic tin/lead (Sn/Pb) or Sn95,5Ag3Cu0,5 or other lead-free solders as agreed between user and supplier (see ISO 9453).
This test method is also applicable to fluxes for use with lead-containing and lead-free solders. However, the soldering temperatures can be adjusted with agreement between tester and customer.
BS EN ISO 9455-17:2024 history
2024BS EN ISO 9455-17:2024 Soft soldering fluxes. Test methods - Surface insulation resistance comb test and electrochemical migration test of flux residues
2006BS EN ISO 9455-17:2006 Soft soldering fluxes. Test methods. Surface insulation resistance comb test and electrochemical migration test of flux residues
2003BS EN ISO 9455-17:2003 Soft soldering fluxes - Test methods - Surface insulation resistance comb test and electrochemical migration test of flux residues