YS/T 543-2006
Semiconductor Bonded Aluminum-1% Silicon Filaments (English Version)

Standard No.

YS/T 543-2006

Language

Chinese, Available in English version

Release Date

2006

Published By

Professional Standard - Non-ferrous Metal

Status

Be replaced 2015-10

Replace By

YS/T 543-2015

Latest

YS/T 543-2015

Replace

GB/T 8646-1998

YS/T 543-2006 history

• 2015 YS/T 543-2015 Aluminum-1% silicon filament for semiconductor bonding
• 2006 YS/T 543-2006 Semiconductor Bonded Aluminum-1% Silicon Filaments

YS/T 543-2006 Semiconductor Bonded Aluminum-1% Silicon Filaments has been changed from GB/T 8646-1998 Fine aluminum-1% silicon wire for semiconductor lend-bonding.