GB/T 8646-1998
Fine aluminum-1% silicon wire for semiconductor lend-bonding (English Version)

Standard No.

GB/T 8646-1998

Language

Chinese, Available in English version

Release Date

1998

Published By

General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China

Status

Withdraw 2007-09

Latest

GB/T 8646-1998

Replace By

YS/T 543-2006

Replace

GB/T 8646-1988

Scope

This standard specifies the requirements, test methods, inspection rules, packaging, marking, transportation and storage of semiconductor bonding aluminum-1% silicon filaments. This standard applies to round drawn A1-1% Si alloy wire for semiconductor bonding.

GB/T 8646-1998 history

• 1998 GB/T 8646-1998 Fine aluminum-1% silicon wire for semiconductor lend-bonding
• 0000 GB/T 8646-1988

GB/T 8646-1998 Fine aluminum-1% silicon wire for semiconductor lend-bonding was changed to YS/T 543-2006 Semiconductor Bonded Aluminum-1% Silicon Filaments.