BS EN 60749-21:2005
Semiconductor devices - Mechanical and climatic test methods - Solderability

Standard No.

BS EN 60749-21:2005

Release Date

2005

Published By

British Standards Institution (BSI)

Status

Be replaced 2011-08

Replace By

BS EN 60749-21:2011

Latest

BS EN 60749-21:2011

Scope

This part of IEC 60749 establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead (SnPb) or lead-free (Pb-free) solder for the attachment. This test method provides a procedure for ‘dip and look’ solderability testing of through hole, axial and surface mount devices (SMDs) as well as an optional procedure for a board mounting solderability test for SMDs for the purpose of allowing simulation of the soldering process to be used in the device application. The test method also provides optional conditions for ageing. This test is considered destructive unless otherwise detailed in the relevant specification.

BS EN 60749-21:2005 history

• 2011 BS EN 60749-21:2011 Semiconductor devices. Mechanical and climatic test methods. Solderability
• 2005 BS EN 60749-21:2005 Semiconductor devices - Mechanical and climatic test methods - Solderability