IEC 60748-22-1:1997
Semiconductor devices - Integrated circuits - Part 22-1: Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures
- Standard No.
- IEC 60748-22-1:1997
- Release Date
- 1997
- Published By
- International Electrotechnical Commission (IEC)
- Latest
- IEC 60748-22-1:1997
- Replace
- IEC 47A/447/FDIS:1996 IEC 60748-22-1:1991
- Scope
- Semiconductor devices -Integrated circuits - Part 22-1: Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures Characteristics and conditions of use..................................................................... Recommended methods of mounting..................................................................... Marking................................................................................................................. Ordering information.............................................................................................. Certified records of released lots........................................................................... Additional information............................................................................................ Additional or increased severities or requirements to those specified in the generic and/or sectional specification................................................................................. Inspection requirements (see tables 2 and 3 or 4 and 5)......................................... Supplement -Tables of method B..........................................................................
IEC 60748-22-1:1997 history
- 1997 IEC 60748-22-1:1997 Semiconductor devices - Integrated circuits - Part 22-1: Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures
- 1991 IEC 60748-22-1:1991 Semiconductor devices; integrated cirucits; part 22: section 1: blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures
