This standard specifies the product classification, technical requirements, test methods, inspection rules, marking, packaging, transportation and storage of silicon single crystal cutting and grinding wafers (silicon wafers for short). This standard applies to circular silicon wafers prepared by Czochralski, suspension zone melting and neutron transmutation doped silicon single crystals after cutting and double-sided grinding. The diameter of silicon wafers ranges from 50.8 to 125mm. The products are used to make semiconductor devices such as transistors and rectifier devices, or to be further processed into polished silicon wafers.
GB/T 12965-1996 history
2018GB/T 12965-2018 Monocrystalline silicon as cut wafers and lapped wafers
2005GB/T 12965-2005 Monocrystalline silicon cut slices and lapped slice
1996GB/T 12965-1996 Monocrystalline silicon as cut slices and lapped slices