IEC 60249-2-17:1992
Base materials for printed circuits; part 2: specifications; specification No. 17: thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

Standard No.

IEC 60249-2-17:1992

Release Date

1992

Published By

International Electrotechnical Commission (IEC)

Status

Withdraw

Replace By

IEC 60249-2-17:1992/COR1:1992

Latest

IEC 60249-2-17:1992/AMD3:2000

Scope

Laminated sheets covered by these specifications (for materials and construction, electrical properties, non-electrical properties of the copper-clad sheet and of the base material, packaging and marking) have thicknesses of the base laminate, excluding

IEC 60249-2-17:1992 history

• 1970 IEC 60249-2-17:1992/AMD3:2000 Amendment 3 - Base materials for printed circuits - Part 2: Specifications - Specification No. 17: Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
• 1970 IEC 60249-2-17:1992/AMD2:1994 Amendment 2 - Base materials for printed circuits - Part 2: Specifications - Specification No. 17: Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
• 1970 IEC 60249-2-17:1992/AMD1:1993 Amendment 1 - Base materials for printed circuits - Part 2: Specifications - Specification No. 17: Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
• 1970 IEC 60249-2-17:1992/COR1:1992 Corrigendum 1 - Base materials for printed circuits - Part 2: Specifications - Specification No. 17: Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
• 1992 IEC 60249-2-17:1992 Base materials for printed circuits; part 2: specifications; specification No. 17: thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

IEC 60249-2-17:1992 Base materials for printed circuits; part 2: specifications; specification No. 17: thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards was changed to IEC 61249-2-11:2003 Materials for printed boards and other interconnection structures - Part 2-11: Reinforced base materials, clad and unclad; Polyimide, brominated epoxide modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical bu.