IEC 60249-2-17:1992/AMD3:2000
Amendment 3 - Base materials for printed circuits - Part 2: Specifications - Specification No. 17: Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

Standard No.

IEC 60249-2-17:1992/AMD3:2000

Release Date

1970

Published By

SCC

Latest

IEC 60249-2-17:1992/AMD3:2000

Replace By

31.180

Replace

2000-08-24

IEC 60249-2-17:1992/AMD3:2000 history

• 1970 IEC 60249-2-17:1992/AMD3:2000 Amendment 3 - Base materials for printed circuits - Part 2: Specifications - Specification No. 17: Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
• 1970 IEC 60249-2-17:1992/AMD2:1994 Amendment 2 - Base materials for printed circuits - Part 2: Specifications - Specification No. 17: Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
• 1970 IEC 60249-2-17:1992/AMD1:1993 Amendment 1 - Base materials for printed circuits - Part 2: Specifications - Specification No. 17: Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
• 1970 IEC 60249-2-17:1992/COR1:1992 Corrigendum 1 - Base materials for printed circuits - Part 2: Specifications - Specification No. 17: Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
• 1992 IEC 60249-2-17:1992 Base materials for printed circuits; part 2: specifications; specification No. 17: thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards