GB/T 15879.604-2023
Mechanical Standardization of Semiconductor Devices Part 6-4: General Rules for Drawing Outline Drawings of Surface Mount Semiconductor Device Packages Dimensional Measurement Methods for Ball Array (BGA) Packages (English Version)

Standard No.

GB/T 15879.604-2023

Language

Chinese, Available in English version

Release Date

2023

Published By

General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China

Latest

GB/T 15879.604-2023

Introduction

GB/T 15879.604-2023 "Mechanical standardization of semiconductor devices Part 6-4: General rules for drawing surface-mounted semiconductor device package outlines - Measurement method for dimensions of ball grid array (BGA) packages" is a standardized document that provides guidelines for measuring the dimensions of BGA packages. BGA packages are widely used in the semiconductor industry due to their high pin density and improved thermal performance. This standard aims to ensure accurate and consistent measurements of BGA package dimensions, which are crucial for the design and manufacturing processes. The document specifies the measurement methods for various dimensions of BGA packages, including the ball pitch, ball diameter, package body size, and ball array size. It also provides guidelines for the graphical representation of BGA package outlines, ensuring clear and concise communication between different stakeholders in the industry. Adhering to this standard enables manufacturers, designers, and users of BGA packages to achieve compatibility and interchangeability of components, facilitating efficient and reliable electronic product assembly. By providing a standardized method for measuring BGA package dimensions, this document promotes quality control and enhances the overall reliability and performance of semiconductor devices. In conclusion, GB/T 15879.604-2023 serves as an essential reference for the measurement of BGA package dimensions. Its implementation ensures consistency, compatibility, and reliability in the design and manufacturing of surface-mounted semiconductor devices.

GB/T 15879.604-2023 history

• 2023 GB/T 15879.604-2023 Mechanical Standardization of Semiconductor Devices Part 6-4: General Rules for Drawing Outline Drawings of Surface Mount Semiconductor Device Packages Dimensional Measurement Methods for Ball Array (BGA) Packages

GB/T 15879.604-2023 -All Parts