GB/T 15879.5-2018
Mechanical standardization of semiconductor devices—Part 5: Recommendations applying to tape automated bonding(TAB) of integrated circuits (English Version)

Standard No.
GB/T 15879.5-2018
Language
Chinese, Available in English version
Release Date
2018
Published By
国家市场监督管理总局、中国国家标准化管理委员会
Latest
GB/T 15879.5-2018
Replace
GB/T 15879-1995

GB/T 15879.5-2018 history

  • 2018 GB/T 15879.5-2018 Mechanical standardization of semiconductor devices—Part 5: Recommendations applying to tape automated bonding(TAB) of integrated circuits
  • 1995 GB/T 15879-1995 Mechanical standardization of semiconductor devices--Part 5: Recommendations applying to tape automated bonding(TAB) of integrated circuits

GB/T 15879.5-2018 Mechanical standardization of semiconductor devices—Part 5: Recommendations applying to tape automated bonding(TAB) of integrated circuits has been changed from GB/T 15879-1995 Mechanical standardization of semiconductor devices--Part 5: Recommendations applying to tape automated bonding(TAB) of integrated circuits.


GB/T 15879.5-2018 -All Parts




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