IEC 62047-10:2011
Dispositifs à semiconducteur – Dispositifs microélectromécaniques – Partie 10: Essai de compression utilisant la technique des micro-piliers pour les matériaux des MEMS (Edition 1.0)
- Standard No.
- IEC 62047-10:2011
- Release Date
- 2011
- Published By
- IEC - International Electrotechnical Commission
- Status
- Replace By
- IEC 62047-10:2011/COR1:2012
- Latest
- IEC 62047-10:2011/COR1:2012
- Replace
- IEC 47F/85/FDIS:2011
- Scope
- This part of IEC 62047 specifies micro-pillar compression test method to measure compressive properties of MEMS materials with high accuracy@ repeatability@ and moderate effort of specimen fabrication. The uniaxial compressive stress-strain relationship of a specimen is measured@ and the compressive modulus of elasticity and yield strength can be obtained. The test piece is a cylindrical pillar fabricated on a rigid (or highly stiff) substrate by micromachining technologies@ and its aspect ratio (ratio of pillar diameter to pillar height) should be more than 3. This standard is applicable to metallic@ ceramic@ and polymeric materials.
IEC 62047-10:2011 history
- 2012 IEC 62047-10:2011/COR1:2012 Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials; Corrigendum 1
- 2011 IEC 62047-10:2011 Dispositifs à semiconducteur – Dispositifs microélectromécaniques – Partie 10: Essai de compression utilisant la technique des micro-piliers pour les matériaux des MEMS (Edition 1.0)
