JB/T 6175-2020
Electronic component lead forming process specifications (English Version)

Standard No.

JB/T 6175-2020

Language

Chinese, Available in English version

Release Date

2020

Published By

工业和信息化部

Latest

JB/T 6175-2020

Replace

JB/T 6175-1992

JB/T 6175-2020 history

• 2020 JB/T 6175-2020 Electronic component lead forming process specifications
• 1992 JB/T 6175-1992 Process specification for forming of instrumentation electronic component lead wire