JB/T 6175-1992
Process specification for forming of instrumentation electronic component lead wire (English Version)

Standard No.

JB/T 6175-1992

Language

Chinese, Available in English version

Release Date

1992

Published By

Professional Standard - Machinery

Status

Be replaced 2021-07

Replace By

JB/T 6175-2020

Latest

JB/T 6175-2020

Scope

This specification specifies the basic contents and requirements for the lead forming process of instrument electronic components. This specification is applicable to the lead forming of electronic components on functional circuit boards of instruments and meters. It is one of the basis for process design and production. Other industries can refer to it.

JB/T 6175-1992 history

• 2020 JB/T 6175-2020 Electronic component lead forming process specifications
• 1992 JB/T 6175-1992 Process specification for forming of instrumentation electronic component lead wire