GB/T 42706.5-2023
Long-term storage of electronic components and semiconductor devices - Part 5: Chips and wafers (English Version)

Standard No.

GB/T 42706.5-2023

Language

Chinese, Available in English version

Release Date

2023

Published By

General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China

Latest

GB/T 42706.5-2023

Introduction

The GB/T 42706.5-2023 standard, titled "Electronic Components - Long-term Storage of Semiconductor Devices - Part 5: Chips and Wafers," provides guidelines for the prolonged storage of chip and wafer semiconductor devices. This standard aims to ensure the preservation of semiconductor devices, including chips and wafers, during long-term storage, thereby maintaining their performance and reliability. The standard outlines procedures for handling, packaging, and storing semiconductor devices to minimize the risk of damage or degradation caused by environmental factors, such as temperature, humidity, and light exposure. It specifies appropriate storage conditions, including temperature and humidity ranges, to prevent moisture absorption, oxidation, or other adverse effects that could affect the functionality of the devices. Additionally, the standard provides recommendations for the labeling and identification of stored semiconductor devices, enabling easy traceability and identification during the storage period. It also outlines the necessary documentation and record-keeping requirements to ensure proper monitoring and control of the storage process. By adhering to the guidelines outlined in this standard, manufacturers, suppliers, and users of semiconductor devices can confidently store chips and wafers for extended periods without compromising their quality or performance. The GB/T 42706.5-2023 standard serves as a valuable reference for the semiconductor industry, contributing to the overall reliability and longevity of electronic components.

GB/T 42706.5-2023 history

• 2023 GB/T 42706.5-2023 Long-term storage of electronic components and semiconductor devices - Part 5: Chips and wafers

GB/T 42706.5-2023 -All Parts