This document is an annex to EIA Engineering Bulletin SSB-1@ Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military@ Aerospace and Other Rugged Applications. This document provides reference information concerning the environmental stresses associated with tests specifically designed to apply to (or have unique implications for) plastic encapsulated microcircuits and semiconductors@ and the specific failures induced by these environmental stresses.
SAE SSB1_002-2014 history
2014SAE SSB1_002-2014 Environmental Tests and Associated Failure Mechanisms
1999SAE SSB1_002-1999 Environmental Tests and Associated Failure Mechanisms (Annex to SSB-1@ Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military@ Aerospace and Other Rugged Applications; Formerly TechAmerica SSB-1.002)