This document specifies the appearance, gelation time, spiral flow length, flash, thermal hardness, density, thermal conductivity, viscosity, glass transition temperature, linear thermal expansion coefficient, water absorption, and flame retardancy of epoxy molding compounds for electronic packaging. Properties, conductivity, pH value, sodium ion content, chloride ion content, bromide ion content, bromine content, antimony content, chlorine content, ash content, uranium content, bending strength, impact strength, molding shrinkage, bond strength, volume resistance The test methods of rate, dielectric constant, dielectric loss, breakdown strength, etc. This document is applicable to performance testing of epoxy molding compounds for electronic packaging of semiconductor discrete devices, integrated circuits and special devices.
GB/T 40564-2021 Referenced Document
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GB/T 40564-2021 history
2021GB/T 40564-2021 Test method of epoxy molding compound for electronic packaging