IEC 60249-3A:1976 Base materials for printed circuits. Part 3 : Special materials used in connection with printed circuits. First supplement: Specification No. 2: Specification for copper foil for use in the manufacture of copper-clad base materials was changed to IEC 61249-5-1:1995 Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials).
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