GOST R IEC 60068-2-83-2017
Environmental testing. Part 2-83. Tests. Test Tf. Solderability testing of electronic components for surface mounting devices by the wetting balance method using solder paste

Standard No.

GOST R IEC 60068-2-83-2017

Release Date

2017

Published By

RU-GOST R

Latest

GOST R IEC 60068-2-83-2017

GOST R IEC 60068-2-83-2017 Referenced Document

• IEC 60068-1:1988 Environmental testing. Part 1: General and guidance
• IEC 60068-2-20:1979 Environmental testing. Part 2: Tests. Test T: Soldering
• IEC 60068-2-58:2004 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
• IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
• IEC 61190-1-3:2007 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

GOST R IEC 60068-2-83-2017 history

• 2017 GOST R IEC 60068-2-83-2017 Environmental testing. Part 2-83. Tests. Test Tf. Solderability testing of electronic components for surface mounting devices by the wetting balance method using solder paste