IEC 61190-1-3:2007 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
GOST R IEC 60068-2-54-2017 history
2017GOST R IEC 60068-2-54-2017 Environmental testing. Part 2-54. Test Ta: Solderability testing of electronic components by the wetting balance method