BS IEC 62047-38:2021
Semiconductor devices. Micro-electromechanical devices. Test method for adhesion strength of metal powder paste in MEMS interconnection
- Standard No.
- BS IEC 62047-38:2021
- Release Date
- 2021
- Published By
- British Standards Institution (BSI)
- Latest
- BS IEC 62047-38:2021
BS IEC 62047-38:2021 history
- 2021 BS IEC 62047-38:2021 Semiconductor devices. Micro-electromechanical devices. Test method for adhesion strength of metal powder paste in MEMS interconnection
